Electronic device

ABSTRACT

According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-099956, filed May 19, 2017, the entire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to an electronic device.

BACKGROUND

Conventionally, electronic devices with a casing accommodating electronic components have been known.

It is beneficial to provide an electronic device with a novel structure and less inconvenience that includes a member including a lead and extending through a casing, for example.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exemplary schematic perspective diagram illustrating an electronic device according to a first embodiment;

FIG. 2 is an exemplary schematic exploded perspective diagram illustrating the electronic device according to the first embodiment;

FIG. 3 is an exemplary schematic exploded perspective diagram illustrating the electronic device according to the first embodiment, as viewed oppositely to FIG. 2;

FIG. 4 is an exemplary schematic cross-sectional diagram taken along the line IV-IV in FIG. 3 illustrating a wiring assembly of the electronic device according to the first embodiment;

FIG. 5 is an exemplary schematic plan view illustrating an FPC included in the wiring assembly according to the first embodiment;

FIG. 6 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly included in an electronic device according to a second embodiment;

FIG. 7 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly of an electronic device according to a third embodiment;

FIG. 8 is an exemplary schematic enlarged diagram illustrating a part of a cross section of an FPC of the wiring assembly according to the third embodiment;

FIG. 9 is an exemplary schematic plan view illustrating the FPC of the wiring assembly according to the third embodiment;

FIG. 10 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly of an electronic device according to a fourth embodiment;

FIG. 11 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly of an electronic device according to a fifth embodiment;

FIG. 12 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly of an electronic device according to a sixth embodiment;

FIG. 13 is an exemplary schematic cross-sectional diagram illustrating a wiring assembly of an electronic device according to a seventh embodiment;

FIG. 14 is an exemplary schematic development diagram illustrating a subassembly including an FPC of the wiring assembly and reinforcement plates according to the seventh embodiment;

FIG. 15 is an exemplary schematic development diagram illustrating a subassembly including an FPC of a wiring assembly and reinforcement plates according to an eighth embodiment;

FIG. 16 is an exemplary schematic cross-sectional diagram of part of a casing with an opening, illustrating a single step of a manufacturing method of a wiring assembly of an electronic device according to a ninth embodiment;

FIG. 17 is an exemplary schematic cross-sectional diagram of the casing with the opening filled with a sealant, illustrating the following step of FIG. 16 in the manufacturing method of the wiring assembly of the electronic device according to the ninth embodiment;

FIG. 18 is an exemplary schematic cross-sectional diagram of the casing with the opening into which a flexible wiring member is inserted, illustrating the following step of FIG. 17 in the manufacturing method of the wiring assembly of the electronic device according to the ninth embodiment; and

FIG. 19 is an exemplary schematic cross-sectional diagram of the wiring assembly in the casing, illustrating the following step of FIG. 18 in the manufacturing method of the wiring assembly of the electronic device according to the ninth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and is electrically connected to a second electrical component outside the casing through the flexible wiring member.

Exemplary embodiments and modifications of an electronic device will be disclosed below. Configurations of embodiments (technical features) described below and actions and results (effects) produced by the configurations are merely exemplary. The configurations of embodiments described below include like or same constituent elements, and each of the embodiments can attain like or same effects on the basis of the like or same constituent elements. In the following, the like constituent elements are denoted by common reference signs, and redundant explanations thereof may be omitted. The accompanying drawings are schematic and do not depict actual dimensions.

First Embodiment

FIG. 1 is a perspective diagram illustrating an external appearance of a hard disk drive (HDD) 100. FIG. 2 is an exploded perspective diagram of the HDD 100. As illustrated in FIG. 1, the HDD 100 includes a flat cuboid casing 10. As illustrated in FIG. 2, the casing 10 includes a base 11, an inner cover 12, and an outer cover 13. The HDD 100 is an example of an electronic device.

The base 11 is a bottomed container and includes a bottom wall 11 a and a peripheral wall 11 b. The bottom wall 11 a has a rectangular and plate-like shape. The peripheral wall 11 b has a plate-like shape and protrudes from the peripheral edge of the bottom wall 11 a at a substantially constant height. The bottom wall 11 a and the peripheral wall 11 b are integrally formed of a metal material such as an aluminum alloy.

As illustrated in FIG. 2, an internal space S of the base 11 is covered by the inner cover 12 and the outer cover 13. The inner cover 12 is fixed to a top surface of the peripheral wall 11 b with coupling members such as screws. The outer cover 13, while covering the inner cover 12, is fixed to a distal end 11 c of the peripheral wall 11 b, for example, by means of welding. The outer cover 13 and the peripheral wall 11 b are air-tightly joined together. In a first embodiment, the bottom wall 11 a, the peripheral wall 11 b, and the outer cover 13 are examples of an outer wall.

The inner cover 12 and the outer cover 13 are provided with air vents 12 a and 13 a, respectively. Components are mounted inside the base 11 first, and then the inner cover 12 and the outer cover 13 are attached to the base 11 to assemble the casing 10. Thereafter, air is removed from the casing 10 through the air vents 12 a and 13 a, and the casing 10 is filled with gas different from air instead. For example, the gas to fill the casing 10 is low-density gas with a lower density than air or inert gas with low reactivity, and exemplified by helium, however, it is not limited to helium. The air vent 13 a of the outer cover 13 is sealed with a seal 13 b to prevent the gas filling the casing 10 from leaking from the air vent 13 a. In this manner, the casing 10 is sealed hermetically in the assembled HDD 100, and simultaneously is filled with gas different from air. The casing 10 may be maintained in a vacuum state or an approximate vacuum state, or may be maintained at a lower pressure than the atmospheric pressure.

As illustrated in FIG. 2, the casing 10 accommodates magnetic disks 14 and a spindle motor 15. The spindle motor 15 is supported on the bottom wall 11 a to rotate the magnetic disks 14 at a predetermined rotational speed about a rotational center Ax1 crossing (perpendicular to) the bottom wall 11 a. The magnetic disks 14 are attached concentrically to a hub (not illustrated) of the spindle motor 15. The number of magnetic disks 14 may be one or two or more. With the multiple magnetic disks 14 mounted as illustrated in the example in FIG. 2, the magnetic disks 14 are parallel to each other and to the bottom wall 11 a.

In the casing 10 a head assembly 16 is supported rotatably on the bottom wall 11 a about a rotational center Ax2 parallel to the rotational center Ax1 via a bearing 17 located radially outside the magnetic disks 14. The head assembly 16 includes arms 16 a extending along the bottom wall 11 a. The number of arms 16 a is equal to the number of magnetic disks 14. A magnetic head 16 c is attached to the distal end of each arm 16 a through a suspension 16 b. The magnetic heads 16 c and the magnetic disks 14 are examples of a first electrical component.

The casing 10 is provided with a voice coil motor (VCM) 18 and a ramp-loading mechanism 19. The VCM 18 controls the rotation and position of the head assembly 16. The ramp load mechanism 19 holds the magnetic heads 16 c at an unloaded position apart from the magnetic disks 14. The VCM 18 is an example of a first electrical component.

FIG. 3 is an exploded perspective diagram of the HDD 100 as viewed oppositely to FIG. 2. As illustrated in FIG. 3, a printed circuit board (PCB) 20 is mounted with a gap on an outer face 11 e of the bottom wall 11 a of the base 11 in parallel to the bottom wall 11 a. The PCB 20 is a rigid circuit board such as a glass epoxy circuit board, a multilayered circuit board, or a build-up circuit board, but is not limited thereto. The PCB 20 includes a first face 20 a and a second face 20 b. The PCB 20 is fixed to the base 11 with a fixing member such as screws or with a snap-fit mechanism such as elastic hooks, with the second face 20 b facing the outer face 11 e and the first face 20 a exposed. On the PCB 20, electrical components (not illustrated) such as an IC, a coil, a capacitor, and a resistor are mounted. These electrical components and wiring on the PCB 20 constitute a control circuit board that controls the operation and computation of the HDD 100. The PCB 20 and the electrical components mounted on the PCB 20 are examples of a second electrical component.

Control signals and data are transmitted between the PCB 20 and the magnetic heads 16 c and between the PCB 20 and the VCM 18 through a wiring assembly 30A (FIGS. 2 and 3). The wiring assembly 30A includes a connector 31 and flexible printed circuit boards (FPCs) 32A and 34. The FPCs 32A and 34 are examples of the flexible wiring member.

FIG. 4 is a cross-sectional diagram of the wiring assembly 30A taken along the line IV-IV in FIG. 3. FIG. 5 is a plan view of the FPC 32A of the wiring assembly 30A.

As illustrated in FIG. 4, the wiring assembly 30A includes the connector 31, the FPC 32A, a connector 33, and the FPC 34.

The connector 31 is fixed to the PCB 20 by soldering. The connector 31 includes an insulating base 31 a and conductive terminals 31 b fixed to the base 31 a. One end (not illustrated) of each terminal 31 b and each terminal 20 c of the PCB 20 are electrically connected by soldering, and thereby, the connector 31 and the PCB 20 are mechanically connected. Further, the terminals 31 b serve as elastic contacts 31 c. When mounting the PCB 20 on the base 11 (the casing 10), the connector 31 and the FPC 32A are pressed against each other, causing the elastic contacts 31 c to be elastically deformed. Thus, the elastically deformed contacts 31 c are electrically connected to contacts 32 e on a first part 32 o of the FPC 32A. The configuration of the connector 31 is not limited to the one in FIG. 4. The connector 31 may be mounted on the FPC 32A. The contacts 32 e are an example of a connection terminal.

The FPC 32A is in form of a thin flat strip film. The FPC 32A includes a first face 32 a and a second face 32 b on the opposite side (back side) of the first surface 32 a.

The FPC 32A has a substantially constant thickness t (FIG. 4). A length lg and a width wd (FIG. 5) of the first face 32 a and the second face 32 b are greater than the thickness t. The FPC 32A includes conductor layers that constitutes leads 32 c (FIG. 5), insulating layers 32 d (FIG. 5), and adhesive layers (not illustrated). The conductor layers, the insulating layers 32 d, and the adhesive layers are laminated on one another. The leads 32 c (conductor layer) are made of a conductive metal material such as a copper-based material. The insulating layers 32 d are made of an insulating synthetic resin material such as polyimide. The insulating layers 32 d may each include a base layer and a cover layer. Direction of thickness refers to a direction crossing (perpendicular to) the first face 32 a and the second face 32 b, and may also be referred to as laminating direction. The insulating layers 32 d are an example of an insulating film.

In the present embodiment, the FPC 32A is a so-called single-sided FPC, for example. That is, as illustrated in FIG. 4, the contacts 32 e (terminals) of the leads 32 c electrically connected to the terminals 31 b of the connectors 31 are mounted on the first face 32 a while no contact 32 e is mounted on the second face 32 b. The contacts 32 e may also be referred to as exposed parts. A cover layer that covers the conductor layers on the first face 32 a is not indispensable.

As illustrated in FIG. 4, the FPC 32A extends through a slit-like through hole 11 d in the bottom wall 11 a of the base 11. The FPC 32A includes a middle part 32 m located inside the through hole 11 d, the first part 32 o exposed to outside the casing 10, and a second part 32 i exposed to inside the casing 10. In the present embodiment, the first part 32 o is positioned outside the casing 10, and the second part 32 i is positioned inside the casing 10. The middle part 32 m may also be referred to as passage. The through hole 11 d is an example of an opening. The magnetic disks 14, the spindle motor 15, the head assembly 16, and the VCM 18 are encapsulated by the casing 10.

The FPC 32A bent into a U-shape along the thickness is fixed to the bottom wall 11 a. The expression “bent along the thickness” means that the first face 32 a and the second face 32 b of the FPC 32A are bent. In the present embodiment, in the first part 32 o, the second face 32 b is fixed to the outer face 11 e of the bottom wall 11 a by bonding, for example. In the second part 32 i, the second face 32 b is fixed to an inner face 11 f of the bottom wall 11 a by bonding, for example. The FPC 32A may be bonded to the bottom wall 11 a through an adhesive applied to the bottom wall 11 a or the FPC 32A or through an adhesive sheet. The FPC 32A may also be fixed to the bottom wall 11 a with a coupling member such as screws.

A clearance between the through hole 11 d of the bottom wall 11 a and the middle part 32 m is filled with a sealant 35. The sealant 35 functions to prevent gas from leaking from the clearance between the through hole 11 d and the middle part 32 m and also secure the middle part 32 m in the through hole 11 d.

As illustrated in FIG. 5, in the first part 32 o of the FPC 32A, two rows of the contacts 32 e are aligned in a width direction W of the FPC 32A. The two rows are spaced apart from each other in a longitudinal direction L of the FPC 32A. Herein, the longitudinal direction L refers to a direction in which the leads 32 c extend along the first face 32 a. The width direction W refers to a direction along the first face 32 a, crossing (perpendicular to) the longitudinal direction L. The leads 32 c extend from the respective contacts 32 e in the longitudinal direction L. The leads 32 c are spaced apart from each other in the width direction W. The second part 32 i of the FPC 32A also has the same configuration as the first part 32 o illustrated in FIG. 5.

As illustrated in FIG. 4, the connector 33 is fixed to a longitudinal end 34 a of the FPC 34 by soldering. The connector 33 has the same configuration as the connector 31 and thus includes an insulating base 33 a and conductive terminals 33 b fixed to the base 33 a. One end (not illustrated) of each terminal 33 b and each terminal 34 b of the FPC 34 are electrically connected by soldering. Thereby, the connector 33 and the FPC 34 are mechanically connected. Further, the terminals 33 b serve as elastic contacts 33 c. The FPC 34 is pressed onto the bottom wall 11 a by a pressing member (not illustrated) attached to the bottom wall 11 a. This places the elastic contacts 33 c in an elastically deformed state, and the elastically deformed contacts 33 c are electrically connected to the contacts 32 e on the second part 32 i of the FPC 32A. The configuration of the connector 33 is not limited to the configuration in FIG. 4. The connector 33 may be mounted on the FPC 32A.

At the other end (not illustrated) of the FPC 34 in its longitudinal direction, leads (not illustrated) of the FPC 34 are electrically connected to the magnetic heads 16 c and the VCM 18. The FPC 32A may also be referred to as primary wiring, while the FPC 34 may also be referred to as secondary wiring.

Due to the configuration as described above, the wiring assembly 30A electrically connects an electrical component (second electrical component) outside the casing 10 such as the PCB 20 to an electrical component (first electrical component) inside the casing 10 such as the magnetic heads 16 c and the VCM 18 through the connector 31, the FPC 32A, the connector 33, and the FPC 34.

As described above, in the present embodiment, the magnetic heads 16 c and the VCM 18 (first electrical component) are electrically connected to the PCB 20 (second electrical component) through the thin flat FPC 32A (flexible wiring member). By such configuration, the cross-sectional area of the passage (the through hole 11 d) from the inside of the casing 10 to outside can be reduced, for example. The inventors have found through their earnest studies that the smaller the cross-sectional area of a synthetic resin material extending through the passage is, the lower the gas permeability in the passage is. In this regard, according to the present embodiment, the thin-film wiring member, i.e., the FPC 32A extends through the passage (the through hole 11 d) of the casing 10, thereby lowering gas permeability in the passage and leading to maintaining the airtightness of the casing 10.

The FPC 32A (flexible wiring member) is more flexible than a rigid circuit board. In addition, the FPC 32A is thinner than a rigid circuit board. The FPC 32A is thus less likely to interfere with other components even if the FPC 32A occupies a longer section of the casing 10. Because of this, according to the present embodiment, by partially bending the FPC 32A along the thickness or bending it along the first face 32 a (the second face 32 b), the layout flexibility of the HDD 100 can be improved, for example, in terms of the position of a passage where the FPC 32A extends through the casing 10, and the position of electrical connection between the FPC 32A and its adjacent electrical components such as the connectors 31 and 33. That is, bending the FPC 32A makes it possible to dispose the contacts 32 e at any distant position from the through hole 11 d (opening). Thus, efficient component arrangement in the HDD 100 is feasible, for example, which may result in achieving a more compact-size HDD 100 and a reduction in manufacturing time and costs for the HDD 100. Further, the inclusion of the FPC 32A leads to increasing a tolerance for misalignment between the two components between which the FPC 32A is interposed, for example, which may also result in attaining reduction in manufacturing time and costs for the HDD 100.

In the present embodiment, the first part 32 o of the FPC 32A is fixed to the outer face 11 e of the bottom wall 11 a (partition wall) of the casing 10, while the second part 32 i of the FPC 32A is fixed to the inner face 11 f of the bottom wall 11 a. With the FPC 32A fixed to at least one of the outer face 11 e and the inner face 11 f of the bottom wall 11 a, for example, the electrical connection between the FPC 32A and the adjacent electrical components including the connectors 31 and 33 can be ensured. Due to the fixation of the FPC 32A to at least one of the outer face 11 e and the inner face 11 f of the bottom wall 11 a, the FPC 32A can be inhibited from being displaced in the through hole 11 d, for example. In the present embodiment, for example, the FPC 32A and the neighboring electrical components are interposed between the bottom wall 11 a and the members (for example, the PCB 20 and the pressing member) mounted on the bottom wall 11 a, utilizing the bottom wall 11 a as a back plate of the FPC 32A. This further facilitates ensuring the electrical connection between the FPC 32A and the neighboring electrical components. In the present embodiment, the FPC 32A is fixed to both the outer face 11 e and the inner face 11 f of the bottom wall 11. That is, the FPC 32A can be more firmly fixed to the bottom wall 11 a, for example.

In the present embodiment, for example, the smaller-size, lighter-weight FPC 32A contributes to downsizing and weight reduction of the HDD 100.

In the present embodiment, a partition wall to which the FPC 32A is fixed is the bottom wall 11 a of the base 11 of the casing 10. This can simplify the configuration of the HDD 100.

The flat flexible wiring member is not limited to the FPCs 32A and 34, and may be a flexible flat cable (FFC).

Second Embodiment

FIG. 6 is a cross-sectional diagram of a wiring assembly 30B according to a second embodiment. The HDD 100 can include the wiring assembly 30B in place of the wiring assembly 30A. The present embodiment is different from the first embodiment in that the wiring assembly 30B includes an FPC 32B bent into an S-shape, and in that the first part 32 o and the second part 32 i of the FPC 32B are distanced from each other along the bottom wall 11 a. In the FPC 32B, the contacts 32 e electrically connected to the terminals 31 b of the connector 31 are provided on the first face 32 a, and the contacts 32 e electrically connected to the terminals 33 b of the connector 33 are provided on the second face 32 b. That is, the FPC 32B is a so-called double-sided FPC.

According to the present embodiment, the layout flexibility of the first part 32 o (and the connector 31) and the second part 32 i (and the connector 33) can be improved, which may result in attaining a more compact HDD 100, and reduction in manufacturing time and costs for the HDD 100, for example. The specifications of the wiring assembly 30B can be changed in various ways. For example, the position of the contacts 32 e and the position of the connectors 31 and 33 are not limited to those illustrated in FIG. 6. The distances from the middle part 32 m of the FPC 32B to the connectors 31 and 33 may be different from each other, or the connectors 31 and 33 may be misaligned from each other vertically relative to the drawing of FIG. 6.

Third Embodiment

FIG. 7 is a cross-sectional diagram of a wiring assembly 30C according to a third embodiment. FIG. 8 is a partially enlarged diagram of an FPC 32C of the wiring assembly 30C. FIG. 9 is a plan view of the FPC 32C. The HDD 100 can include the wiring assembly 30C in place of the wiring assembly 30A. The present embodiment is different from the above embodiments in that the FPC 32C of the wiring assembly 30C is formed by coupling an FPC 32C1 and an FPC 32C2 to each other. The FPC 32C may also be referred to as a coupled FPC or integrated FPC. As illustrated in FIG. 7, each of the FPCs 32C1 and 32C2 is, for example, a so-called single-sided FPC, has the same configuration as the FPC 32A in the first embodiment, and is attached to the bottom wall 11 a of the casing 10, extending through the through hole 11 d in the bottom wall 11 a, as with the FPC 32A. The FPC 32C is an example of a flexible wiring member. The FPC 32C1 is an example of a first flexible wiring member. The FPC 32C2 is an example of a second flexible wiring member.

However, as illustrated in FIGS. 7 and 8, the U-shaped FPC 32C1 and FPC 32C2 are integrated through a connection 32 f with their respective U-shapes reversed to each other. The connection 32 f is interposed between a middle part 32 m of the FPC 32C1 and a middle part 32 m of the FPC 32C2 to integrate the two middle parts 32 m. The connection 32 f is an example of a joint. The first part 32 o of the FPC 32C1 and the first part 32 o of the FPC 32C2 extend from the connection 32 f in a direction away from each other. The second part 32 i of the FPC 32C1 and the second part 32 i of the FPC 32C2 extend from the connection 32 f in a direction away from each other. The two middle parts 32 m and the connection 32 f extend through the through hole 11 d of the bottom wall 11 a. The connection 32 f includes a core layer 32 f 1 at the center, and two bonding layers 32 f 2 (adhesive layers) placing the core layer 32 f 1 in-between. The bonding layers 32 f 2 bond the core layer 32 f 1 to the FPC 32C1 and to the FPC 32C2. The core layer 32 f 1 and the bonding layers 32 f 2 all have insulating properties. The core layer 32 f 1 is made of a synthetic resin material such as polyimide. As illustrated in FIG. 8, the lead 32 c (conductor layer) of the FPC 32C1 and the lead 32 c (conductor layer) of the FPC 32C2 may be electrically connected through a conductor such as vias 32 g extending through the connection 32 f.

The connectors 31 and 33 are disposed across the FPCs 32C1 and 32C2. The connector 31 includes the terminals 31 b electrically connected to the contacts 32 e of the FPC 32C1, and the terminals 31 b electrically connected to the contacts 32 e of the FPC 32C2. The connector 33 includes the terminals 33 b electrically connected to the contacts 32 e of the FPC 32C1, and the terminals 33 b electrically connected to the contacts 32 e of the FPC 32C2.

As understood from FIGS. 7 and 9, according to the present embodiment, the middle parts 32 m and the connection 32 f can be placed between two rows of the contacts 32 e aligned in the width direction W of the FPC 32C. This can reduce the installation area of the FPC 32C in the bottom wall 11 a (outer wall). Thus, the wiring assembly 30C according to the present embodiment can be made more compact in size, therefore, be more effective when a greater number of leads 32 c (the contacts 32 e and the terminals 31 b and 34 b) is set.

Fourth Embodiment

FIG. 10 is a cross-sectional diagram of a wiring assembly 30D according to a fourth embodiment. The HDD 100 can include the wiring assembly 30D in place of the wiring assembly 30A. The present embodiment is different from the above embodiments in that an FPC 32D of the wiring assembly 30D includes reinforcement plates 36D1 and 36D2, and in that a subassembly including the FPC 32D and the reinforcement plates 36D1 and 36D2 covers the through hole 11 d in the bottom wall 11 a of the casing 10 from inside the casing 10. In the present embodiment, the first part 32 o, the second part 32 i exposed to the inside of the casing 10, and the middle part 32 m are all positioned in the casing 10. The subassembly including the FPC 32D and the reinforcement plates 36D1 and 36D2 is attached to the bottom wall 11 a with a fixing member (not illustrated) such as screws.

The reinforcement plates 36D1 and 36D2 are made of a metal material such as an aluminum alloy or a ferrous alloy. However, the materials of the reinforcement plates 36D1 and 36D2 are not limited thereto. The reinforcement plates 36D1 and 36D2 are, for example, rectangular plate members with a constant thickness greater than the FPC 32D. Each of the reinforcement plates 36D1 and 36D2 includes a first face 36 a joined to the FPC 32D and a second face 36 b on the opposite side. The reinforcement plates 36D1 and 36D2 may have a same shape. The first face 36 a is an example of an outer face. The second face 36 b is an example of an inner face. In the present embodiment, the subassembly including the FPC 32D and the reinforcement plates 36D1 and 36D2 can be considered as part of the casing 10 (the bottom wall 11 a).

For example, the FPC 32D is a so-called single-sided FPC and has the same configuration as the FPC 32A according to the first embodiment. However, in the present embodiment, the first part 32 o of the FPC 32D is fixed to the first face 36 a of the reinforcement plate 36D1 by bonding. The second part 32 i of the FPC 32D is fixed to the first face 36 a of the reinforcement plate 36D2 by bonding. The middle part 32 m between the first part 32 o and the second part 32 i of the FPC 32D is bent into a U-shape. The reinforcement plates 36D1 and 36D2 are placed on top of each other in the thickness direction, with the second face 36 b of the reinforcement plate 36D1 and the second face 36 b of the reinforcement plate 36D2 facing each other. That is, the U-shaped FPC 32D holds not the bottom wall 11 a but the two reinforcement plates 36D1 and 36D2 put on top of each other in the thickness direction between the first section 32 o and the second section 32 i. In the present embodiment, the two reinforcement plates 36D1 and 36D2 placed on top of each other are examples of a partition wall. The thickness direction of the reinforcement plates 36D1 and 36D2 refers to a direction crossing (perpendicular to) the first face 36 a and the second face 36 b. Of the two reinforcement plates 36D1 and 36D2, the first face 36 a of the reinforcement plate 36D1 located outside the casing 10 is an example of an outer face, and the first face 36 a of the reinforcement plate 36D2 located inside the casing 10 is an example of an inner face. The first part 32 o is an example of a first fixed part. The second part 32 i is an example of a second fixed part. The two reinforcement plates 36D1 and 36D2 may be integrated as a subassembly by bonding, for instance, or closely placed on top of each other when attaching the subassembly to the casing 10 with a fixing member such as screws. The two reinforcement plates 36D1 and 36D2 may not be bonded, and an insulating layer, an adhesive layer, or a cushion layer may be inserted between the two reinforcement plates 36D1 and 36D2, for example. The configuration of the subassembly including an FPC and reinforcement plates is not limited to the example in FIG. 10. For example, the subassembly may be the U-shaped FPC 32D that holds a single reinforcement plate between the first part 32 o and the second part 32 i in the thickness direction between the first section 32 o and the second section 32 i.

A gap between the FPC 32D (subassembly) and the bottom wall 11 a of the casing 10 is sealed with a sealant 37. The sealant 37 is endlessly applied along the peripheral edge of the through hole 11 d in the bottom wall 11 a to seal the gap between the inner face 11 f of the bottom wall 11 a and the first face 32 a of the FPC 32D or the first face 36 a of the reinforcement plate 36D1 at the peripheral edge of the through hole 11 d.

As described above, in the present embodiment, the reinforcement plates 36D1 and 36D2 (partition walls) to which the FPC 32D is fixed are attached to cover the through hole 11 d (opening) in the bottom wall 11 a (outer wall) from the inside of the casing 10. Thus, according to the present embodiment, for example, the reinforcement plates 36D1 and 36D2 can inhibit distortion of the FPC 32D caused by a difference in pressure between inside and outside the casing 10 or by an external force, and can help firmly secure the FPC 32D onto the casing 10.

In the present embodiment, as illustrated in FIG. 10, the FPC 32D passes between the bottom wall 11 a and the reinforcement plate 36D1. Thus, according to the present embodiment, for example, the bottom wall 11 a does not need to be provided with a relatively small, narrow, slit-type through hole. Further, as illustrated in FIG. 10, in the present embodiment, the connector 31 is accommodated in the through hole 11 d of the bottom wall 11 a. Thus, according to the present embodiment, for example, as compared with the connector 31 placed on the outer face 11 e or the inner face 11 f of the bottom wall 11 a, the HDD 100 can be made more compact in size in the thickness direction of the bottom wall 11 a, that is, in the direction crossing (perpendicular to) the outer face 11 e and the inner face 11 f of the bottom wall 11 a.

Fifth Embodiment

FIG. 11 is a cross-sectional diagram of a wiring assembly 30E according to a fifth embodiment. The HDD 100 can include the wiring assembly 30E in place of the wiring assembly 30A. The present embodiment is different from the above embodiments in that the second part 32 i of an FPC 32E of the wiring assembly 30E is provided with a reinforcement plate 36E but the first part 32 o is provided with no reinforcement plate, in that, of a subassembly including the FPC 32E and the reinforcement plate 36E, the second part 32 i and the reinforcement plate 36E cover the through hole 11 d in the bottom wall 11 a of the casing 10 from outside the casing 10, and in that the first part 32 o and the second part 32 i are distanced from each other along the bottom wall 11 a. In the present embodiment, the first part 32 o facing (exposed) outside of the casing 10, the second part 32 i exposed to the inside of the casing 10, and the middle part 32 m are all positioned outside the outer face 11 e of the casing 10. The subassembly including the FPC 32E and the reinforcement plate 36E is attached to the bottom wall 11 a with a fixing member (not illustrated) such as screws. In the present embodiment, the reinforcement plate 36E can be regarded as part of the casing 10 (the bottom wall 11 a).

In the FPC 32E, the contacts 32 e electrically connected to the terminals 31 b of the connector 31 are provided on the first face 32 a while the contacts 32 e electrically connected to the terminals 33 b of the connector 33 are provided on the second face 32 b. That is, the FPC 32E is a so-called double-sided FPC.

According to the present embodiment, the layout flexibility of the first part 32 o (and the connector 31) and the second part 32 i (and the connector 33) can be improved. This may result in attaining a more compact HDD 100 in size and reduction in manufacturing time and costs for the HDD 100, for example. The specifications of the wiring assembly 30E can be changed in various ways. For example, the positions of the contacts 32 e and the connectors 31 and 33 are not limited to those illustrated in FIG. 11. The distances to the connectors 31 and 33 from the middle part 32 m of the FPC 32E may be different from each other. The connectors 31 and 33 may be misaligned from each other vertically relative to the drawing of FIG. 11.

Sixth Embodiment

FIG. 12 is a cross-sectional diagram of a wiring assembly 30F according to a sixth embodiment. The HDD 100 can include the wiring assembly 30F in place of the wiring assembly 30A. In the present embodiment, the wiring assembly 30F includes an FPC 32F which is formed by coupling an FPC 32F1 and an FPC 32F2 as in the third embodiment illustrated in FIG. 7. The FPC 32F is, for example, a so-called single-sided FPC, as with the first and third embodiments. The FPC 32F is an example of a flexible wiring member. The FPC 32F1 is an example of a first flexible wiring member. The FPC 32F2 is an example of a second flexible wiring member.

In the present embodiment, a subassembly including the FPC 32F and a reinforcement plate 36F covers the through hole 11 d in the bottom wall 11 a of the casing 10 from inside the casing 10 in the same manner as in the fourth embodiment illustrated in FIG. 10. In the present embodiment, the reinforcement plate 36F can be regarded as part of the casing 10 (the bottom wall 11 a).

However, the present embodiment is different from the fourth embodiment in that the U-shaped FPCs 32F1 and 32F2 each hold not the bottom wall 11 a but a single reinforcement plate 36F by extending through a through hole 36 d in the reinforcement plate 36F. The present embodiment can attain similar effects to those of the third embodiment and the fourth embodiment.

Seventh Embodiment

FIG. 13 is a cross-sectional diagram of a wiring assembly 30G according to a seventh embodiment. FIG. 14 is a development diagram of a subassembly of the wiring assembly 30G including an FPC 32G and the reinforcement plates 36D1 and 32D2. The HDD 100 can include the wiring assembly 30G in place of the wiring assembly 30A. In the present embodiment, the subassembly including the FPC 32G and the reinforcement plates 36D1 and 36D2 covers the through hole 11 d in the bottom wall 11 a of the casing 10 from inside the casing 10, as in the fourth embodiment illustrated in FIG. 10. In the present embodiment, the FPC 32G is also bonded to the reinforcement plates 36D1 and 36D2.

However, in the present embodiment, the wiring assembly 30G does not include the FPC 34 of the above embodiments, and the FPC 32G includes a third part 32 h as an alternative to the FPC 34. The third part 32 h extends from the second part 32 i oppositely to the first part 32 o. The third part 32 h is connected to electrical components (first electrical component) in the casing 10 such as the magnetic heads 16 c and the VCM 18 at a distant position (not illustrated) from the second part 32 i opposite the first part 32 o. The electrical components in the casing 10 such as the magnetic heads 16 c and the VCM 18 are electrically connected to the PCB 20 and electrical components (second electrical component) mounted on the PCB 20 through the leads 32 c of the FPC 32G. That is, the wiring assembly 30G in the present embodiment is regarded as being equivalent to the integrated FPC 32D and FPC 34 without the connector 33 in the fourth embodiment illustrated in FIG. 10.

According to the present embodiment, for example, the number of parts or components can be reduced, which can reduce manufacturing time and costs for the wiring assembly 30G. In the present embodiment, in the FPC 32G, the second part 32 i, located between the first part 32 o and the end of the FPC 32G connected to the electrical components in the casing 10 such as the magnetic heads 16 c and the VCM 18, is joined to the reinforcement plate 36D2 (partition wall). Thus, an elastic repulsive force from a distortion or motion of the third part 32 h acts mainly on the second part 32 i, which reduces the repulsive force acting on the first part 32 o. Thus, according to the present embodiment, for example, degradation of the sealability of the sealant 37 can be inhibited by allowing the elastic repulsive force from the distortion or motion of the third part 32 h to act onto the first part 32 o.

As illustrated in FIG. 14, the FPC 32G includes a conductor layer 32 j (32 j 1, 32 j 2, and 32 j 3) in addition to the leads 32 c through which data and control signals are transmitted.

For example, the conductor layer 32 j and the leads 32 c are both laminated on the insulating layer 32 d in the same process. In other words, the leads 32 c and the conductor layer 32 j are at the same position in the thickness direction of the FPC 32G. However, the conductor layer 32 j and the leads 32 c may be provided on different layers. The conductor layer 32 j may also be electrically connected to a ground conductor (not illustrated), for example.

In the present embodiment, within the first part 32 o and the second part 32 i of the FPC 32G, regions that overlap with the reinforcement plates 36D1 and 36D2 (bonded regions 32 n in FIG. 13) are bonded in their entirety to the reinforcement plates 36D1 and 36D2. The conductor layer 32 j is placed to overlap with the ends of the bonded regions 32 n of the FPC 32G. That is, as illustrated in FIG. 14, the conductor layer 32 j includes conductor layers 32 j 1, 32 j 2, and 32 j 3. The conductor layers 32 j 1 and 32 j 2 are provided respectively at ends 32 p 1 and 32 p 2 (peripheral edge) of the first part 32 o or the second part 32 i. The conductor layer 32 j 3 is placed to overlap with ends 36 e (peripheral edge) of the reinforcement plates 36D1 and 36D2 in the first part 32 o or the second part 32 i. The conductor layer 32 j 1 extends in the width direction W at the end 32 p 1 of the FPC 32G in its longitudinal direction L. The conductor layer 32 j 2 extends in the longitudinal direction L at the end 32 p 2 of the FPC 32G in its width direction W. In the first part 32 o or the second part 32 i, the conductor layer 32 j 3 is located to overlap with, in the thickness direction of the FPC 32G, the ends 36 e of the reinforcement plates 36D1 and 36D2 adjacent to the middle part 32 m. In other words, the ends 36 e are part of the peripheral edges of the reinforcement plates 36D1 and 36D2 and covered by the FPC 32G. A peripheral edge of the FPC 32G is an end of the first face 32 a or the second face 32 b, in other words, an end of the FPC 32G in a direction crossing (perpendicular to) the first face 32 a or the second face 32 b, that is, in the thickness direction of the FPC 32G. The peripheral edges of the reinforcement plates 36D1 and 36D2 are an end of the first face 36 a or the second face, in other words, ends of the reinforcement plates 36D1 and 36D2 in a direction crossing (a direction perpendicular to) the first face 36 a or the second face 36 b, that is, in the thickness direction of the reinforcement plates 36D1 and 36D2. The thickness direction of the reinforcement plates 36D1 and 36D2 refers to a direction crossing (perpendicular to) the first face 36 a and the second face 36 b. The thickness direction of the FPC 32G is the same as the thickness direction of the reinforcement plates 36D1 and 36D2. That is, the FPC 32G and the reinforcement plates 36D1 and 36D2 overlap one another in the thickness direction of the FPC 32G and the thickness direction of the reinforcement plates 36D1 and 36D2.

The conductor layer 32 j is provided away from the middle part 32 m being a bent part of the FPC 32G in the thickness direction. The middle part 32 m is an example of a bent part in a thickness direction. The bent part of the FPC 32G in the thickness direction means that the first face 32 a and the second face 32 b are bent into a convex or concave form.

As described above, according to the present embodiment, the reinforcement plates 36D1 and 36D2 (partition walls) are bonded to the FPC 32G. The FPC 32G includes the conductor layer 32 j located so as to overlap with the ends of the bonded regions 32 n of the reinforcement plates 36D1 and 36D2. The conductor layer 32 j can prevent liquid including water from penetrating the FPC 32G in the thickness direction and degrading an adhesive on the bonded regions. When a force acts on either the FPC 32G or the reinforcement plates 36D1 and 36D2 bonded via the bonded regions 32 n of the FPC 32G in such a manner as to remove these elements from the bonded regions 32 n, the peripheral edge (end) of the bonded regions 32 n is a likely starting point of the removal. In this regard, in the present embodiment, the FPC 32G includes the conductor layer 32 j, which can inhibit penetration of liquid into the FPC 32G in the thickness direction, at the overlapping positions with the ends of the bonded regions 32 n. Thus, according to the present embodiment, for example, the FPC 32G and the reinforcement plates 36D1 and 36D2 are prevented from being detached from each other from the ends of the bonded regions 32 n. The specifications such as the size and length of the conductor layer 32 j are not limited to those illustrated in FIGS. 13 and 14, and various modifications can be made.

If the conductor layer 32 j is provided on the middle part 32 m of the FPC 32G, it may be difficult to bend the middle part 32 m in the thickness direction. In this regard, in the present embodiment, the conductor layer 32 j is provided away from the middle part 32 m of the FPC 32G, so that the conductor layer 32 j does not interfere with the bending of the FPC 32G in the thickness direction.

Eighth Embodiment

FIG. 15 is a development diagram of a subassembly of a wiring assembly 30H including an FPC 32H and the reinforcement plate 36D1. The HDD 100 can include the wiring assembly 30H in place of the wiring assembly 30A. In an eighth embodiment, the FPC 32H and the reinforcement plate 36D1 are also bonded to each other. The FPC 32H includes the conductor layer 32 j according to the seventh embodiment, the leads 32 c, and conductor layers 32 k 1 and 32 k 2 different from the conductor layer 32 j. The conductor layers 32 k 1 and 32 k 2, the leads 32 c, and the conductor layer 32 j are laminated on the insulating layer 32 d in the same process. In other words, the leads 32 c and the conductor layers 32 k 1, 32 k 2, and 32 j are at the same position of the FPC 32H in the thickness direction. However, the conductor layers 32 k 1 and 32 k 2 may be provided on a different layer from the conductor layer 32 j and the leads 32 c. The conductor layers 32 k 1 and 32 k 2 may also be electrically connected to a ground conductor (not illustrated), for example.

According to the present embodiment, the conductor layers 32 k 1 and 32 k 2 of the FPC 32H can further inhibit penetration of liquid into the FPC 32H in the thickness direction. This can further prevent the FPC 32H and the reinforcement plate 36D1 from being detached from each other. The specifications such as the position and size of the conductor layers 32 k 1 and 32 k 2 are not limited to those illustrated in FIG. 15, and various modifications can be made.

In the present embodiment, as illustrated in FIG. 15, the reinforcement plate 36D1 is provided with through holes 36 c into which coupling members such as screws (not illustrated) are inserted. The FPC 32H includes protrusions 32 q that extend from ends 32 p 2 to the through holes 36 c and overlap with the heads of the coupling members. Due to the configuration as described above, by the protrusions 32 q placed between the heads of the coupling members and the reinforcement plate 36D1, the FPC 32H is less likely to be detached from the reinforcement plate 36D1. The middle part 32 m of the FPC 32H may be provided with a cutout, a through hole, a bottomed hole, or a slit. In this case, the middle part 32 m of the FPC 32H is more easily bent, which reduces an elastic repulsive force of the bent middle part 32 m. That is, the FPC 32H and the reinforcement plate 32D1 are even less likely to be detached from each other.

Ninth Embodiment

FIGS. 16 to 19 are cross-sectional diagrams illustrating steps of a manufacturing method of a wiring assembly 30I (FIG. 19). The configuration of the wiring assembly 30I is almost the same as the configuration of the wiring assembly 30A in the first embodiment except for the shape of the through hole 11 d.

As illustrated in FIG. 16, in a ninth embodiment, the through hole 11 d in the bottom wall 11 a has a greater width Who in the outer face 11 e than a width Whi in the inner face 11 f. A width Wh of the through hole 11 d widens toward outside of the casing 10 (in the thickness direction of the bottom wall 11 a, that is upward in FIG. 16). In the present embodiment, the width Wh of the through hole 11 d widens gradually and smoothly. However, the width Wh may widen in a stepwise manner. As illustrated in FIGS. 18 and 19, the width Wh of the through hole 11 d is in a thickness direction (a transverse direction in FIG. 16) of an FPC 32A1 that extends through the through hole 11 d.

Next, as illustrated in FIG. 17, the sealant 35 in liquid form (in a soft and unset state) is injected into the through hole 11 d from outside to inside of the casing 10. Because of the shape of the through hole 11 d (the non-uniform width Wh described above) and the viscosity of the sealant 35, the sealant 35 remains in the through hole 11 d in a state as illustrated in FIG. 17.

Next, as illustrated in FIG. 18, the FPC 32A1 is inserted into the through hole 11 d and the soft sealant 35 from outside to inside of the casing 10. The configuration of the FPC 32A1 is the same as the configuration of the FPC 32A in the first embodiment except that the second section 32 i is covered with a cover 32 r such as a film. The cover 32 r is detachably affixed to (temporarily held on) the second part 32 i by an operator or through a robotic operation so as not to leave an adhesive when detached. The cover 32 r is removed from the second part 32 i after the second part 32 i has passed through the sealant 35. That is, by the configuration and manufacturing processes of the wiring assembly 30I as described above, the sealant 35 does not attach to the second part 32 i when the second part 32 i passes through the through hole 11 d in which the sealant 35 remains. In FIG. 18, the cover 32 r is magnified in thickness for the sake of easier understanding. However, the cover 32 r is so thin in practice that the second part 32 i covered with the cover 32 r can pass through the through hole 11 d.

Next, as illustrated in FIG. 19, the FPC 32A1 is bent into a U-shape such that the first part 32 o extends along the outer face 11 e and the second part 32 i extends along the inner face 11 f. The first part 32 o is fixed to the outer face 11 e by bonding, for example. The second part 32 i is fixed to the inner face 11 f by bonding. The sealant 35 is hardened to form the wiring assembly 30I (excluding the connectors). The width Whi of one end of the through hole 11 d inside the casing may be greater than the width Who of the other end of the through hole 11 d outside the casing. In this case, the sealant 35 is injected from the inside end of the casing. The first part 32 o may pass through the through hole 11 d and the sealant 35. In this case, the first part 32 o is covered with the cover 32 r. The first part 32 o and the second part 32 i may also be both covered with the cover 32 r.

The present embodiment described above can facilitate injection or application of the sealant 35 into or onto the through hole 11 d, and reduce unevenness in the sealant 35 to thereby improve sealability thereof, for example. The configuration and the manufacturing method according to the present embodiment are also applicable to the through holes 11 d and 36 d in the other embodiments.

While embodiments and modifications of the present invention have been exemplified above, the above embodiments and modifications are only examples, and it is not intended that the present invention is limited thereto. These embodiments and modifications can be carried out in other various modes, and various types of omissions, replacements, combinations, and changes can be made without departing from the scope of the present invention. These embodiments and modifications are incorporated in the spirit and scope of the invention, and are incorporated in the inventions described in the scope of claims and their equivalents. Further, the configurations and shapes described in the respective embodiments and the respective modifications can be partially replaced with one another. The specifications of respective configurations and forms (such as constitution, type, direction, shape, size, length, width, thickness, height, number, arrangement, position, and material) can be changed as appropriate.

For example, the electronic device is not limited to an HDD. In addition, the specifications including the shape and size of the electronic device are not limited to those described in the above embodiments. The first electrical component can be any electrical component provided inside the casing, and is not limited to those described in the above embodiments. The second electrical component can be any electrical component provided outside the casing, and is not limited to those described in the above embodiments. The specifications including the shape and size of the flexible wiring member and the position of each element are not limited to those described in the above embodiments. For example, The flexible wiring member may include conductor layers and leads spaced apart from each other in the thickness direction. The flexible wiring member may extend through a wall of the casing different from the bottom wall. The casing may not be sealed hermetically and may contain air. 

What is claimed is:
 1. An electronic device comprising: a casing provided with an opening; a flexible wiring member comprising an insulating film, a lead mounted on the insulating film, and a connection terminal, the flexible wiring member that extends through the opening; a sealant filled in the opening; and a first electrical component encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.
 2. The electronic device according to claim 1, wherein The first electrical component is hermetically sealed with the casing, the flexible wiring member, and the sealant.
 3. The electronic device according to claim 1, wherein the flexible wiring member comprises a first flexible wiring member and a second flexible wiring member which are extending in a direction away from each other in at least inside or outside of the casing.
 4. The electronic device according to claim 3, wherein the first flexible wiring member and the second flexible wiring member are coupled in the opening.
 5. The electronic device according to claim 4, further comprising: a connection interposed between and coupling the first flexible wiring member and the second flexible wiring member in the opening.
 6. The electronic device according to claim 5, wherein the first flexible wiring member and the second flexible wiring member are electrically connected through a conductive portion which is extending through a via in the connection.
 7. An electronic device comprising: a casing provided with an opening; a partition wall provided above the opening; a flexible wiring member fixed at least partially to the partition wall, comprising a first part exposed to outside the casing and a second part exposed to inside the casing; and a first electrical component accommodated in the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.
 8. The electronic device according to claim 7, wherein the partition wall is positioned inside or outside an outer face of the casing.
 9. The electronic device according to claim 8, wherein the flexible wiring member is inserted between the partition wall and the casing.
 10. The electronic device according to claim 7, wherein the flexible wiring member comprises a first fixed part fixed to an outer face of the partition wall, and a second fixed part fixed to an inner face of the partition wall.
 11. The electronic device according to claim 10, wherein the flexible wiring member is connected to the second electrical component with a spacing from the first fixed part, or is connected to the first electrical component with a spacing from the second fixed part.
 12. The electronic device according to claim 10, wherein the flexible wiring member comprises a first flexible wiring member and a second flexible wiring member that are coupled to each other, the first fixed part of the first flexible wiring member and the first fixed part of the second flexible wiring member extend from a joint between the first flexible wiring member and the second flexible wiring member in a direction away from each other, and the second fixed part of the first flexible wiring member and the second fixed part of the second flexible wiring member extend from the joint in a direction away from each other.
 13. The electronic device according to claim 12, wherein the partition wall is bonded to the flexible wiring member, and the flexible wiring member comprises a conductor layer positioned so as to overlap with an end of a bonded region between the flexible wiring member and the partition wall.
 14. The electronic device according to claim 13, wherein the flexible wiring member comprises the conductor layer at a peripheral edge or at an overlapping position with a peripheral edge of the partition wall in a thickness direction of the flexible wiring member.
 15. The electronic device according to claim 13, wherein the conductor layer is spaced away from a bent part of the flexible wiring member.
 16. The electronic device according to claim 1, wherein the flexible wiring member is a flexible printed circuit board. 